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        1. 工程主管英文簡歷

          時間:2022-05-17 11:14:06 英文簡歷模板 我要投稿
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          工程主管英文簡歷模板

            求職者之所以將很多宣言寫入個人簡歷,其主要目的在于通過自己表示的決心,讓招聘單位感覺到只要求職者獲得工作的機會,必然會認認真真的完成全部工作任務,將企業作為全部生活的中心。其實企業需要的人才不需要將工作作為生活的全部,懂得享受生活的人才,才能更好的適應工作環境。單純以各類求職宣言提高簡歷的通過率效果微乎其微,甚至影響到招聘單位對于求職者的正確判斷。尤其在制作個人簡歷書寫各類求職宣言,不如將大量的篇幅提供與書寫求職者的工作經驗。

          工程主管英文簡歷模板

            企業在招聘的時候,對于高學歷與豐富經驗的求職者認可度非常高。能夠針對企業崗位突出自身技能優勢,可以贏得企業的垂憐。幫助每位求職者在更短的時間內,找到更加適合自己的工作崗位,達到高薪就業的目標。提高個人簡歷的競爭力,不斷的書寫求職宣言毫無意義,能夠將自己的高學歷與工作經歷突出顯示,可以贏得招聘單位認可。從而在優質個人簡歷的幫助下,順利完成就業,并且就業的崗位能夠達到求職者與其的標準。

            以下是yjbys小編和大家分享的工程主管英文簡歷模板,更多相關資訊請點擊(www.ruiwen.com/jianli)。

          NAme:yjbys Hukou: 
          Residency:  Work Experience: 
          Current Salary:  Tel: 
          E-mail:www.ruiwen.com/jianli
          Career Objective
          Desired Industry:  
          Desired Position: Director ,Chief Representative ,Branch Office Manager
          Desired address: Shanghai Desired Salary: ¥20,000-29,999/Month
          Work Experience
          2007/06—Present ***Company
            Industry: Electronics/Semiconductor/IC
          Quality QA/QC Manager
          Responsibilities:
          1. On-time delivery of quality products.
          2. Daily monitoring of actual quality and quality reports.
          3. Controlling and reducing quality cost while maintaining or improving quality thru training programs, cross training of workers, process improvement together with production or suppliers.
          4. Ongoing interaction with production department to fully implement any required quality improvements.
          5. Daily communication with VP in US on quality issues.
          Report Directly to: US operation VP     
          Reason for Leaving: family factor
          2005/12—2007/03 Liteon semiconductor
            Industry: Electronics/Semiconductor/IC
          Quality Reliability Assurance QRA director
          Responsibilities:
          1. Manage the department Goal and Objective Planning (KPI)in QC, QA, QS, EHS, RoHS, lab section. Coordinate cross department activities & problem solving.
          2. Lead cooperate business plan and strategies review and optimization.
          3. Lead cooperate supply chain management to secure raw material delivery & quality assurance & supply base development.
          4. In cooperate level take part in the NPD and NPI project setup & executions.
          5. Lead NPD qualification through APQP and PPAP.
          6. Lead top management review of quality-oriented production performance.
          7. Lead CQE team in response to customer complaints and problem solving to achieve total customer satisfaction.
          8. Securing product, process change control and systematically retaining documented knowledge (including SOP, standards, specifications, PCN, ECN) within the organization.
          Report Directly to: General Manager  Number of Subordinate:116
          Reason for Leaving: business depression & working environment
          Achievements:
          1. RoHS system build-up and optimization.
          2. 40% reduction of customer quality complaints.
          3. Top 3 ranking of OEM customer satisfaction (ST, on semi).
          4. Lead re-certificate of ISO14000 and TS16949.
          5. Reliability engineering capability build-up to support NPD project to win time-to-market.
          6. Get quality system audit success from Sony, Samsung, LG, and Omron to gain business opportunity.
          7. CQE and supply chain management system setup.
          2004/03—2005/08 "On" semiconductor (Spun off from Motorola)
            Industry: Electronics/Semiconductor/IC
          Strategic product Engineering Product Engineering Manager
          Responsibilities:
          1. Take initiative to set up and manage strategic product engineering team and coordinate 3 cooperate business units NPD and NPI projects in Asia pacific region through joint technical and marketing efforts with counterparts in cooperate level worldwide. The task included Marketing analysis, new product development & introduction, process and productivity improvement, new package & test development, continuous manufacture cost-down campaign etc. All of them are strictly in compliance with cooperate strategy “time to market” and “profit margin maximum” to reinforce company competitiveness in dynamic market environment.
          2. In order to fulfill technical support need to local key customers and further R&D requirement of testing capability and capacity I independently handle new characterization lab establishment covering complicated budget review, equipment list definition, logistic issue forecast, lab layout preparation, subcontractor selection, facility construction management, regular quality audit, final inspection and qualification etc. working with HR on lab engineer hiring process.
          3. Closely collaborate with application and customer quality engineer in customer-orientated manner on product complaint and quality issue feedback, technical consultation of diversified IC category etc.
          4. Strategic outsourcing activities including supplier assessment, screening, management. Integrate supplier technical expertise into stepping up company business profit margin; cost reduction, product competitiveness etc.
          Reason for Leaving: organization change
          2003/06—2004/02 Grace Semiconductor Manufacture Cooperation
            Industry: Electronics/Semiconductor/IC
          QRA Engineering Senior Engineer leader
          Responsibilities:
          1. To be partner with technical development organization and take leadership to conduct total qualification projects of advanced process reliability of CMOS technology. Take use of various quality analysis tools on process stability & normal deviation, evaluation of product lifetime, yield indicator like Cp, Cpk etc. take ownership to write up a set of official qualification reports in line with requirement of ISO9001 and QS9000 as well as customer justification requirement.
          2. Solid hand-on experiences on various reliability tests in lab and take management role of equipments and lab staffs on my own.
          3. Working with FA sector to do failure analysis experiment to dig out root cause of low performance of in-line process. Failure mechanism study is essential to reveal drawback in new technology development process and provide improvement advice and approach to R&D staffs.
          4. Act as single technical contact window with customers with advice related to product reliability issue. Demonstrate product quality level to customer from reliability performance aspect to build up confidence and attract more orderings.
          5. Supply management to support IC package and other consuming material purchase in daily mass reliability tests.
          6. People performance management.
          Reason for Leaving: personal development
          1998/02—2003/06 Intel
            Industry: Electronics/Semiconductor/IC
          Test & Assembly Engineering Engineer leader
          Responsibilities:
          1. Management in testing & assembly operation setup for three new factories startup.
          2. Manage NPI and NPD projects in wide cooperation with test & Assembly & product engineering teams around Asia pacific region and in USA.
          3. Supplier management to drive continuous cost reduction in high volume manufacturing and new material development for NPI and NPD.
          4. Customer technical support on product issues.
          5. Testing & assembly team management to drive various kinds of engineering projects to achieve the quality continuous improvement & productivity increase & cost saving.
          6. ISO9000 certification.
          Reason for Leaving: personal development
          1993/09—1998/02 Shanghai textile hardware Factory
            Industry: Machinery, Equipment, Heavy Industries
          Technical Engineering Electrical Engineer leader
          Responsibilities:
          1. NPI project (10 million RMB) management with one year oversea working experience. The project covered business and technical negotiation including CNC machine & tool procurement, Process technique transfer, Automatic production line setup & qualification & pilot run & mass production.
          2. Equipment line & people management for troubleshooting and maintenance.
          3. NPD management with CAD design & CNC programming & first article qualification.
          4. Customer management on product quality & application issues.
          5. Supplier management for spare part & raw material localization & cost-reduction projects.
          Reason for Leaving: personal development
          Education and Training
          2002/03—2005/01 Fu Dan University Microelectronics Master
          1998/09—2001/07 Shanghai Jiao Tong University Computer Application Bachelor
          1990/09—1993/07 Shanghai Textile Academy Electrical Engineering and Automation
          2004/11—2004/12 Internal training People hiring and management
          2002/03—2002/05 Internal training Finance and business management basic
          1999/05—2000/02 Internal training Total Quality Management
          Professional Skills
          Language Skills: English: VERY GOOD
          Self-appraisal
          Self-motivated fast learner team work spirit good team leadership strict discipline sense good interpersonal skill.


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